ETIII SA

Frequently bought together:

Description

ETIII Fixture
• 11° Morse Taper platform structure provides more stability against external loads
Minimize the bone loss by changing fixture platform
• Gingival suturing is much easier since the implant placement is at bone level
• 1.5° taper body allows immediate and early loading

SA (Sand-blasted with alumina and Acid-etched)
• After blasting with 250 ~ 500㎛ alumina, the surface is etched with Sulfuric acid and Hydrochloric acid
• 100㎛ Micro crates and 1~3㎛ Micro-pits

Narrow (Diameter 3.2mm)
• Optimized for narrow ridge
• Compatible with 'mini' platform components excluding cover screw, mount, and lab analog
• For Ø3.2 fixture, the connection is 0.5mm shorter

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Additional Information

System:
Excellent Treatment (ET)
Product Category:
ETIII SA
Surface:
SA
Surface Roughness:
Ra 2.5 ~ 3.0㎛
Connection:
Internal Hex
Implant Type:
Submerged
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