Description
ETIII Fixture
• 11° Morse Taper platform structure provides more stability against external loads
• Minimize the bone loss by changing fixture platform
• Gingival suturing is much easier since the implant placement is at bone level
• 1.5° taper body allows immediate and early loading
SA (Sand-blasted with alumina and Acid-etched)
• After blasting with 250 ~ 500㎛ alumina, the surface is etched with Sulfuric acid and Hydrochloric acid
• 100㎛ Micro crates and 1~3㎛ Micro-pits
Narrow (Diameter 3.2mm)
• Optimized for narrow ridge
• Compatible with 'mini' platform components excluding cover screw, mount, and lab analog
• For Ø3.2 fixture, the connection is 0.5mm shorter
Additional Information
System: |
Excellent Treatment (ET) |
Product Category: |
ETIII SA |
Surface: |
SA |
Surface Roughness: |
Ra 2.5 ~ 3.0㎛ |
Connection: |
Internal Hex |
Implant Type: |
Submerged |